Appartus and method for forming pattern

ABSTRACT

A pattern forming apparatus includes a drawing chamber having a drawing substrate on which an original pattern is drawn, a first temperature control unit having a first temperature regulator to make the temperature of the drawing chamber constant, and a constant-temperature member arranged near the drawing substrate. The pattern forming apparatus further includes a second temperature control unit having a second temperature regulator. The second temperature control unit is configured to control the set temperature of the constant-temperature member independently such that the temperature of the drawing substrate becomes substantially constant when the original pattern is drawn.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of co-pending U.S. application Ser. No.10/329,514, filed Dec. 27, 2002, and to which priority is claimed under35 U.S.C. §121. This application is based upon and claims the benefit ofpriority under 35 U.S.C. § 119 from the prior Japanese PatentApplication No. 2001-398013, filed Dec. 27, 2001, the entire contents ofboth applications are incorporated herein by reference in theirentireties. the entire contents of which are incorporated herein byreference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a pattern forming apparatus and apattern forming method. More specifically, the invention relates to anapparatus and a method for manufacturing a reticle (or a mask) on whichat least one original pattern is drawn.

2. Description of the Related Art

Recently, the circuit trace widths required for semiconductor deviceshave become narrower and narrower as an LSI (Large Scale IntegratedCircuit) increases in packing density and capacity. This type ofsemiconductor device is conventionally fabricated by transferringseveral tens of kinds of original patterns with a desired circuitpattern from a reticle aligned with high precision to an exposure domainon a wafer.

Step-and-repeat equipment including a highly precise optical system anda highly precise X-Y stage is used for the transfer of the originalpatterns. The wafer is fixed on the X-Y stage so that its whole surfacecan be exposed with the original patterns, and moved relative to theoptical system by step and repeat. Therefore, the step-and-repeatequipment is also referred to as a stepper.

The original pattern on the reticle is drawn on a glass substrate thatis finished with high precision and formed as a chromium (Cr) patternthrough an etching process and the like. Chromium (Cr) is usuallyvapor-deposited on one side of the glass substrate and resist is applieduniformly on the chromium (Cr). When the chromium (Cr) pattern isformed, the glass substrate is irradiated with an energy beam (electronbeam) from an energy beam optical system. The resist-coated surface ofthe glass substrate is entirely scanned with a beam spot correspondingto design (drawing) data. Thus, an arbitrary chromium (Cr) pattern isformed by controlling chromium (Cr) etching according to the place ofthe substrate, using the resist deteriorated at the time of the scan.The chromium (Cr) pattern is formed by combining the narrowed beam spotsinto one original pattern. It is thus possible to draw a fine originalpattern with high precision by controlling the positions of the beamspots accurately.

It has been said that the old stepper cannot resolve an original patternof 1 micron or less in terms of the wavelength limit of light. Thepresent stepper can resolve a fine original pattern of the order ofsubmicron because of the improvement in optical and illumination systemsand the appearance of a phase shift mask that controls the phase oflight on a reticle.

If, however, the glass substrate varies in temperature during thedrawing of a fine original pattern on the glass substrate, it expandsand contracts. During the drawing, the glass substrate is fixed on adrawing stage whose position is controlled precisely. The control of aplace of the glass substrate for drawing an original pattern isperformed on the basis of the measured values of a laser interferometer.However, the laser interferometer cannot sense the expansion orcontraction of the glass substrate under drawing. If, therefore, thetemperature of the glass substrate changes during the drawing, apositional error occurs in the drawn original pattern. The glasssubstrate is made chiefly of synthetic quartz. The coefficient a oflinear expansion of synthetic quartz is 0.4×10⁻⁶. Assuming that thetemperature of the glass substrate under drawing changes one degree (1°C.), a distance of 130 mm between two points on the glass substratechanges 52 nm (=130×10^(6×1)×α). This change is considered to be apositional error over a place for drawing the original pattern. In otherwords, it is necessary to always keep the temperature of the glasssubstrate under drawing constant.

To resolve the above problem, conventionally, constant-temperature waterwhose temperature is regulated with high accuracy is caused to flow neara drawing chamber including a drawing stage, and the temperature of thedrawing chamber is regulated to stabilize the temperature of the glasssubstrate. However, various machine parts are arranged around the glasssubstrate. For example, an electrooptic barrel, which irradiates a glasssubstrate with an electron beam, generates heat with electric power thatdrives a coil. This heat generation is one of causes to vary thetemperature of the glass substrate. In order to eliminate this problem,the temperature of constant-temperature water has to be regulatedquickly in accordance with temperature variations of the glasssubstrate. Since, however, the above machine parts are very heavy, theirfollow-up characteristic to the temperature variations of theconstant-temperature water is extremely poor. Moreover, the machineparts are heat generation sources and the amounts of heat to begenerated vary from part to part. Thus, the influence upon the glasssubstrate on which an original pattern is to be formed varies from placeto place. As described above, it is very difficult to keep thetemperature of the glass substrate under drawing constant even thoughthe temperature of the drawing chamber is simply regulated.

BRIEF SUMMARY OF THE INVENTION

A first object of the present invention is to provide a pattern formingapparatus that is capable of keeping the temperature of a drawingsubstrate more constant when an original pattern is drawn on the drawingsubstrate and also capable of drawing a fine original pattern with highprecision.

A second object of the present invention is to provide a pattern formingmethod that is capable of keeping the temperature of a drawing substratemore constant when an original pattern is drawn on the drawing substrateand also capable of drawing a fine original pattern with high precision.

In order to attain the first object, a pattern forming apparatusaccording to one aspect of the present invention comprises: a drawingchamber including a drawing substrate on which an original pattern isdrawn; a first temperature control unit having a first temperatureregulator, the first temperature control unit being configured to make atemperature of the drawing chamber constant; a constant-temperaturemember arranged near the drawing substrate; and a second temperaturecontrol unit having a second temperature regulator, the secondtemperature control unit being configured to control a set temperatureof the constant-temperature member independently such that a temperatureof the drawing substrate becomes substantially constant when theoriginal pattern is drawn.

In order to attain the second object, a pattern forming method accordingto another aspect of the present invention comprises: measuring atemperature of a dummy substrate, which is included in a drawing chamberwhose temperature is made constant by a first temperature control unit,using a first temperature measuring device when an original pattern isdrawn on the dummy substrate while the dummy substrate is varying inposition; computing temperature distribution of the dummy substratebased on the temperature measured by the first temperature measuringdevice; and controlling a second temperature control unit based on thetemperature distribution, the second temperature control unit beingconfigured to control a set temperature of a constant-temperature memberindependently of a temperature of the drawing chamber when the originalpattern is drawn on a drawing substrate, and the constant-temperaturemember being arranged near the drawing substrate.

In order to attain the second object, a pattern forming method accordingto still another aspect of the present invention comprises: measuring atemperature of a drawing substrate, which is included in a drawingchamber whose temperature is made constant by a first temperaturecontrol unit, using a second temperature measuring device when anoriginal pattern is drawn on the drawing substrate; and controlling asecond temperature control unit based on the temperature measured by thesecond temperature measuring device, the second temperature control unitbeing configured to control a set temperature of a constant-temperaturemember independently of a temperature of the drawing chamber when theoriginal pattern is drawn on the drawing substrate while the drawingsubstrate is varying in position, and the constant-temperature memberbeing arranged near the drawing substrate.

According to the pattern forming apparatus and pattern forming methoddescribed above, the temperature of the glass substrate on which anoriginal pattern is drawn can be controlled with high precision,independently of the temperature of the drawing chamber. Thus, thefollow-up characteristic to the temperature variations ofconstant-temperature water can greatly be improved.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

FIG. 1 is a block diagram showing a configuration of a reticlemanufacturing apparatus as an example of a fine pattern formingapparatus according to a first embodiment of the present invention;

FIG. 2 is a cross-sectional view taken along line II-II of FIG. 1;

FIG. 3A is a graph of the distribution of temperature before thetemperature of a dummy mask used in the reticle manufacturing apparatusbecomes constant;

FIG. 3B is a graph showing the distribution of temperature after thetemperature of the dummy mask becomes constant; and

FIG. 4 is a block diagram showing a configuration of a reticlemanufacturing apparatus according to a second embodiment of the presentinvention.

DETAILED DESCRIPTION OF THE INVENTION

Embodiments of the present invention will now be described withreference to the accompanying drawings.

First Embodiment

FIGS. 1 and 2 show an example of a configuration of a fine patternforming apparatus according to a first embodiment of the presentinvention. In the first embodiment, a reticle manufacturing apparatusfor drawing an original pattern on a glass substrate to manufacture areticle is taken as an example of the fine pattern forming apparatus.The apparatus includes a drawing chamber 11, and the drawing chamber 11has a circulation path 12 through which the temperature-controlled firstconstant-temperature water (coolant) 13 circulates in the up and down,right and left, and forward and backward walls of the drawing chamber11. The temperature of the first constant-temperature water 13 isregulated (controlled) with high precision by a first temperatureregulator 15. The first temperature regulator 15 makes up a firsttemperature control unit, together with a main control circuit 47(described later).

The drawing chamber 11 contains an X-Y stage (drawing stage) 21. The X-Ystage 21 holds a glass substrate (not shown) serving as a drawingsubstrate on which an original pattern is drawn. The X-Y stage 21 isfreely moved and driven in X and Y directions by a drive unit 23. Theposition of the X-Y stage 21 is precisely measured by a laserinterferometer 25.

The above glass substrate is formed by vapor-depositing chromium (Cr) onone side of glass raw material such as synthetic quartz and thenapplying resist thereon uniformly. The resist-applied surface of theglass substrate is irradiated with an electron beam B from an electronbeam optical system 27 serving as an energy beam optical system and thewhole surface of the glass substrate is scanned with a beam spotcorresponding to drawing data. Thus, an arbitrary chromium (Cr) patternis formed by controlling chromium (Cr) etching according to a place ofthe glass substrate, using the resist that deteriorated on the occasionof the scan. Therefore, a reticle is manufactured in which an originalpattern corresponding to at least a desired circuit pattern is drawn onthe glass pattern.

In the drawing chamber 11, a constant-temperature member 31 is arrangedopposite to the glass substrate. The constant-temperature member 31covers the end portion of the electron beam optical system 27 and has ahole 31 a through which the electron beam B emitted from the end portionof the system 27 passes. The constant-temperature member 31 also has acirculation path 32 through which second constant-temperature water(coolant) 33, which is temperature-controlled with high precision,circulates in the wall opposed to at least the glass substrate. Thetemperature of the second constant-temperature water 33 is controlled(regulated) by a second temperature regulator 35 that is providedseparately from the first temperature regulator 15. The secondtemperature regulator 35 makes up a second temperature control unit,together with a main control circuit 47 (described later).

In the reticle manufacturing apparatus according to the firstembodiment, the constant-temperature member 31 is provided near theglass substrate and its temperature can be controlled independently ofthat of the drawing chamber 11. When an original pattern is drawn on theglass substrate, the temperature of the second constant-temperaturewater 33 flowing in the constant-temperature member 31 is regulated bythe second temperature regulator 35 with high precision. Thus, thefollow-up characteristic of the second constant-temperature water 33 totemperature variations in the glass substrate can greatly be improved.Therefore, the glass substrate under drawing can be maintained at analmost constant temperature more easily than when the temperature of theglass substrate is stabilized only by the drawing chamber 11.Consequently, a fine original pattern can be drawn with high precision.

The temperature of the second constant-temperature water 33 is regulatedusing a dummy mask (dummy substrate) 41 as shown in FIG. 1. The dummymask 41 is made of the same material as that of the glass substrate andformed in substantially the same shape as that of the glass substrate.Moreover, the dummy mask 41 includes a thermometer (first temperaturemeasuring device) 41 a. As will be described later, the thermometer 41 ameasures the temperature of the dummy mask 41 when an original patternis drawn on the dummy mask 41, as in the case where an original patternis actually drawn on the glass substrate. In this case, not only thetemperature of an arbitrary portion of the dummy mask 41 can bemeasured, but also a temperature variation of the dummy mask 41 due tothe movement of the X-Y stage 21 (a temperature difference due to thevariation in position) can be measured by measuring the temperature ofthe dummy mask 41 while moving the X-Y stage 21.

The above reticle manufacturing apparatus includes a storage circuit 43,a computing circuit 45 serving as an arithmetic circuit, and a maincontrol circuit 47. The storage circuit 43 stores measurement resultsobtained by the thermometer 41 a. For example, it stores the temperatureof the dummy mask 41 held on the X-Y stage 21 when the original patternis actually drawn on the dummy mask 41. The storage circuit 43 issupplied with the measurement results from the thermometer 41 a throughwiring 21 b in a supporting arm 21 a of the X-Y stage 21. The computingcircuit 45 computes the distribution of temperature varied with themovement of the dummy mask 41 based on the measurement results of thetemperature of the dummy mask 41 stored in the storage circuit 43. Themain control circuit 47 controls the first and second temperatureregulators 15 and 35 based on the above temperature distributioncomputed by the computing circuit 45.

The above-described reticle manufacturing apparatus includes a drawingcontrol circuit 49 which supplies a correction value to drawing data fordrawing an original pattern with the electron beam optical system 27when the needed arises. For example, the drawing control circuit 49corrects the drawing data based on the measurement results of thetemperature of the dummy mask 41 stored in the storage circuit 43.

An operation of drawing an original pattern on a glass substrate in theabove reticle manufacturing apparatus (a method of manufacturing areticle) will now be described. Before starting a manufacture of areticle, the dummy mask 41 including the thermometer 41 a is held on theX-Y stage 21. An original pattern is actually drawn on the dummy mask 41by the electron beam optical system 27 while varying the position of thedummy mask 41. At this time, the temperature of the dummy mask 41 ismeasured in sequence by the thermometer 41 a. More specifically, thedummy mask 41 is held on the X-Y stage 21 and then the inner part of thedrawing chamber 11 is evacuated by a vacuum device (not shown). Thefirst temperature regulator 15 controls the temperature of the firstconstant-temperature water 13 and keeps the set temperature of thedrawing chamber 11 constant. In this state, the drive unit 23 moves theX-Y stage 21 in the X and Y directions while the laser interferometer 25measures the position of the X-Y stage 21 accurately. Thus, an originalpattern is drawn in a given position on the dummy mask 41 by irradiatingthe moving dummy mask 41 with an electron beam B from the electron beamoptical system 27. The output of the laser interferometer 25 is used tocontrol the irradiation position of the electron beam B. When theoriginal pattern is drawn, the thermometer 41 a measures the temperatureof the dummy mask 41 and the storage circuit 43 stores the measuredtemperature.

After the temperature of the dummy mask 41 is measured at the time ofdrawing, the manufacture of the actual reticle, i.e., the drawing of theoriginal pattern on the glass substrate starts. Specifically, the glasssubstrate is held on the X-Y stage 21. After that, as in the above case,the inner part of the drawing chamber 11 is evacuated and the firsttemperature regulator 15 controls the temperature of the firstconstant-temperature water 13 to keep the set temperature of the drawingchamber 11 constant.

Moreover, on the occasion of the manufacture of the actual reticle, thecomputing circuit 45 computes the distribution of temperature variedwith the movement of the dummy mask 41 based on the measurement resultsstored in the storage circuit 43. Based on the temperature distribution,the main control circuit 47 controls at least the second temperatureregulator 35. In this case, the main control circuit 47 obtains such settemperature as to minimize a variation of the temperature of the glasssubstrate held on the X-Y stage 21 from the temperature distribution.The second temperature regulator 35 controls the secondconstant-temperature water 33 based on the set temperature and maintainsthe set temperature of the constant-temperature member 31 at the optimalfixed temperature (constant temperature).

In this state, the drive unit 23 moves the X-Y stage 21 in the X and Ydirections while the laser interferometer 25 is measuring the positionof the X-Y stage 21 precisely. Thus, the electron beam optical system 27emits the electron beam B to draw an original pattern in a givenposition on the glass substrate while the glass substrate is moving.Since the temperature of the glass substrate under drawing is keptalmost constant, a fine original pattern can be drawn with highprecision. In other words, the material and shape of the dummy mask 41used for measurement of temperature are substantially the same as thoseof the glass substrate used for manufacture of the reticle. Therefore,the temperature of the glass substrate under drawing can easily be keptalmost constant by making the temperature of the constant-temperaturemember 31 constant by the set temperature based on the measurementresults (distribution) of the temperature of the dummy mask 41.Consequently, an original pattern can be drawn with almost no positionalerrors.

FIGS. 3A and 3B show the distribution of temperature varied with themovement of the dummy mask 41. FIG. 3A shows the temperaturedistribution obtained before the temperature of the constant-temperaturemember 31 is optimized. For example, the set temperature of the drawingchamber 11 is 22.48° C. (incidentally the set temperature of theconstant-temperature member 31 is 22.89° C.). FIG. 3B shows thetemperature distribution obtained after the temperature of theconstant-temperature member 31 is optimized. For example, the settemperature of the drawing chamber 11 is 22.48° C. and that of theconstant-temperature member 31 is 22.59° C.

In the above case, the temperature distribution is repeatedly obtainedwhile varying the set temperature of the constant-temperature member 31,and the set temperature in the temperature distribution in which thetemperature variation becomes the smallest is used as the optimumtemperature of the constant-temperature member 31.

In FIG. 3A, reference numeral 101 indicates a range of temperature of23.03° C. to 23.035° C., 102 a range of temperature of 23.025° C. to23.03° C., 103 a range of temperature of 23.02° C. to 23.025° C., 104 arange of temperature of 23.015° C. to 23.02° C., 105 a range oftemperature of 23.01° C. to 23.015° C., 106 a range of temperature of23.005° C. to 23.01° C., 107 a range of temperature of 23.0° C. to23.005° C., 108 a range of temperature of 22.995° C. to 23.0° C., 109 arange of temperature of 22.99° C. to 22.995° C., 110 a range oftemperature of 22.985° C. to 22.99° C., 111 a range of temperature of22.98° C. to 22.985° C., 112 a range of temperature of 22.975° C. to22.98° C., 113 a range of temperature of 22.97° C. to 22.975° C., 114 arange of temperature of 22.965° C. to 22.97° C., 115 a range oftemperature of 22.96° C. to 22.965° C., 116 a range of temperature of22.955° C. to 22.96° C., and 117 a range of temperature of 22.95° C. to22.955° C.

In FIG. 3B, reference numeral 201 indicates a range of temperature of22.925° C. to 22.93° C., 202 a range of temperature of 22.92° C. to22.925° C., 203 a range of temperature of 22.915° C. to 22.92° C., 204 arange of temperature of 22.91° C. to 22.915° C., 205 a range oftemperature of 22.905° C. to 22.91° C., and 206 a range of temperatureof 22.9° C. to 22.905° C.

As is apparent from FIGS. 3A and 3B, the temperature difference is 0.085(=23.035−22.95)° C. before the temperature of the member 31 is optimallymade constant, whereas the temperature difference is 0.03 (=22.93−22.9)°C. after it is optimally made constant. It is seen from this, too thatit is effective in maintaining the constant temperature of the glasssubstrate under drawing to make the temperature of theconstant-temperature member 31 constant by the optimum temperature orregulate the set temperature of the second constant-temperature water 33based on the temperature distribution obtained before the member 31 isoptimally made constant and make the set temperature of the member 31optimum.

As described above, the follow-up characteristic of the secondconstant-temperature water to the temperature variations of the glasssubstrate can greatly be improved. In other words, theconstant-temperature member whose temperature can be controlledindependently of that of the drawing chamber is provided to control theset temperature of the constant-temperature member on the basis of theresults obtained by previously measuring the temperature of the dummymask which is substantially equal to that of the glass substrate. Thus,the constant-temperature member can easily be made constant by theoptimum temperature that corresponds to substantially the constanttemperature of the glass substrate under drawing. Therefore, thetemperature of the glass substrate can be made more constant when theoriginal pattern is drawn than when the temperature of the glasssubstrate is stabilized only in the drawing chamber; consequently, afine original pattern can be drawn with high precision, too.

In the foregoing first embodiment, the temperature of theconstant-temperature member 31 is made constant or the member 31 is socontrolled that its set temperature becomes constant. The firstembodiment is not limited to this. For example, the set temperature ofthe constant-temperature member 31 can easily be varied with themeasured temperature of the dummy mask 41 so as not to cause adifference in the temperature of the glass substrate under drawing dueto the variations in position. In this case, a fine original pattern canbe formed with higher precision.

When an original pattern is drawn on the glass substrate, the drawingcontrol circuit 49 can supply a correction value to drawing data fordrawing the original pattern based on the measured temperature of thedummy mask 41 (for example, temperature distribution). It is thuspossible to draw a fine original pattern with higher precision and, inthis case, the advantage can greatly be improved in combination with thecontrol of the set temperature of the constant-temperature member 31. Inother words, when the drawing data is corrected on the basis of thedistribution of temperature varied with the movement of the dummy mask41, a fine original pattern can sufficiently be drawn with highprecision to some extent, irrespective of the control of the settemperature of the constant-temperature member 31.

The first embodiment is not limited to the control of only the settemperature of the constant-temperature member 31. For example, thetemperature of the glass substrate can be stabilized at the time ofdrawing by controlling the set temperature of each of theconstant-temperature member 31 and drawing chamber 11 based on thetemperature distribution obtained when the temperature of the dummy mask41 is measured.

Second Embodiment

FIG. 4 shows an example of a configuration of a fine pattern formingapparatus according to a second embodiment of the present invention. Thesecond embodiment is directed to a reticle manufacturing apparatus fordrawing an original pattern on a glass substrate to manufacture areticle. In this apparatus, the temperature of the glass substrate ismeasured at the time of drawing and the set temperature of aconstant-temperature member is controlled based on the measurementresults. As shown in FIG. 4, a thermometer (second temperature measuringdevice) 51 is attached on an X-Y stage 21. The thermometer 51 measuresthe temperature of a glass substrate 53 held on the X-Y stage 21 when anoriginal pattern is drawn thereon. In the reticle manufacturingapparatus, the thermometer 51 attached on the X-Y stage 21 is used inplace of the thermometer 41 a included in the dummy mask 41 in the firstembodiment and measures the temperature of the glass substrate 53 insequence when a reticle is manufactured.

When the drawing of an original pattern on the glass substrate 53 (themanufacture of a reticle) actually starts, the thermometer 51 measuresthe temperature of the glass substrate 53. Based on the temperaturemeasured in sequence, a second temperature regulator 35 regulates thetemperature of the second constant-temperature water 33 flowing in aconstant-temperature member 31 with high precision through, for example,a storage circuit 43, a computing circuit

and a main control circuit 47. Thus, the set temperature of theconstant-temperature member 31 is varied such that the glass substrate53 can always be maintained at the optimum temperature, and thetemperature of the glass substrate 53 can be made constant at the timeof drawing.

In the second embodiment, the set temperature of theconstant-temperature member 31 can sequentially be varied with thevariation in the position of the glass substrate 53 (position of the X-Ystage 21) based on the temperature of the glass substrate 53 measured bythe thermometer 51. Consequently, a fine original pattern can be formedwith high precision without varying in temperature due to the variationsin the position of the glass substrate 53.

In the second embodiment, too, the temperature of theconstant-temperature member 31 is made constant as in the foregoingfirst embodiment. In other words, the constant-temperature member 31 caneasily be controlled such that its set temperature becomes constant.

Moreover, as in the first embodiment, when an original pattern is drawnon the glass substrate 53, a drawing control circuit 49 can supply acorrection value to drawing data for drawing the original pattern basedon the measured temperature of the glass substrate 53. Thus, a fineoriginal pattern can be drawn with high precision. In this case, too,the advantage can greatly be improved in combination with the control ofthe set temperature of the constant-temperature member 31. In otherwords, when the drawing data is corrected on the basis of the measuredtemperature of the glass substrate 53, a fine original pattern cansufficiently be formed with high precision to some extent, irrespectiveof the control of the set temperature of the constant-temperature member31.

The second embodiment is not limited to the control of only the settemperature of the constant-temperature member 31. For example, thetemperature of the glass substrate 53 can be stabilized at the time ofdrawing by controlling the set temperature of each of theconstant-temperature member 31 and drawing chamber 11 based on themeasured temperature of the glass substrate 53.

Neither the first embodiment nor the second embodiment is limited to theabove reticle manufacturing apparatus but can be applied to varioustypes of fine pattern forming apparatus.

Additional advantages and modifications will readily occur to thoseskilled in the art. Therefore, the invention in its broader aspects isnot limited to the specific details and representative embodiments shownand described herein. Accordingly, various modifications may be madewithout departing from the spirit or scope of the general inventiveconcept as defined by the appended claims and their equivalents.

1. A pattern forming method comprising: measuring a temperature of adummy substrate, which is included in a drawing chamber whosetemperature is made constant by a first temperature control unit, usinga first temperature measuring device when an original pattern is drawnon the dummy substrate while the dummy substrate is varying in position;computing temperature distribution of the dummy substrate based on thetemperature measured by the first temperature measuring device; andcontrolling a second temperature control unit based on the temperaturedistribution, the second temperature control unit being configured tocontrol a set temperature of a constant-temperature member independentlyof a temperature of the drawing chamber when the original pattern isdrawn on a drawing substrate, and the constant-temperature member beingarranged near the drawing substrate.
 2. The pattern forming methodaccording to claim 1, wherein the controlling includes controlling theconstant-temperature member such that the constant-temperature member isset at a constant set temperature.
 3. The pattern forming methodaccording to claim 1, further comprising supplying a correction value todrawing data to draw the original pattern using an energy beam opticalsystem based on the temperature measured by the first temperaturemeasuring device.
 4. A pattern forming method comprising: measuring atemperature of a drawing substrate, which is included in a drawingchamber whose temperature is made constant by a first temperaturecontrol unit, using a second temperature measuring device when anoriginal pattern is drawn on the drawing substrate; and controlling asecond temperature control unit based on the temperature measured by thesecond temperature measuring device, the second temperature control unitbeing configured to control a set temperature of a constant-temperaturemember independently of a temperature of the drawing chamber when theoriginal pattern is drawn on the drawing substrate while the drawingsubstrate is varying in position, and the constant-temperature memberbeing arranged near the drawing substrate.
 5. The pattern forming methodaccording to claim 4, wherein the controlling includes controlling theset temperature of the constant-temperature member in accordance withthe temperature of the drawing substrate.
 6. The pattern forming methodaccording to claim 4, further comprising supplying a correction value todrawing data to draw the original pattern using an energy beam opticalsystem based on the temperature measured by the second temperaturemeasuring device.